THICK FILM HYBRID ELECTRONIC CIRCUITS
In our assembly lines we're producing on customer' design and specifications:
-design and development of lay-out for ceramic and printed wired substrates.
-production of thick film electronic circuits for industrial, professional, medical applications.
-assemblies of special electronic modules on ceramic or other special substrates.
-COB (chip-on-board) of silicon dies using ball-bonding process.
-COB (chip-on-board) of silicon dies using wedge-bonding process.
-Integrated pull-test and advanced shear test available.
Our modern CAD/CAE development systems are at your service to develop your electronics device by using hybrid thick-film technology over any kind of substrate, from ceramic to multilayer printed wires, flexyprint and others.
Our offer includes an advanced assembly service for microelectronic and SMD devices, for ball and for wedge bonding process (COB) of silicon dies and MEMS, held in clean room environment.
-design and development of lay-out for ceramic and printed wired substrates.
-production of thick film electronic circuits for industrial, professional, medical applications.
-assemblies of special electronic modules on ceramic or other special substrates.
-COB (chip-on-board) of silicon dies using ball-bonding process.
-COB (chip-on-board) of silicon dies using wedge-bonding process.
-Integrated pull-test and advanced shear test available.
Our modern CAD/CAE development systems are at your service to develop your electronics device by using hybrid thick-film technology over any kind of substrate, from ceramic to multilayer printed wires, flexyprint and others.
Our offer includes an advanced assembly service for microelectronic and SMD devices, for ball and for wedge bonding process (COB) of silicon dies and MEMS, held in clean room environment.
