Metallux Switzerland - Hybrid circuits, COB

» METALLUX IN THE WORLD

» Press releases

scarica swf player

> PRESSURE SENSORS

> HYBRID CIRCUITS, COB

> MOTION CONTROL MODULES

Fill in for receiving a complete documentation or data sheets of our products

HYBRID CIRCUITS, COB

The thick film technology offered by METALLUX SA is based on over 35 years of experience. The hybrid circuits are designed and produced in order to meet the customer requirements. We guarantee reliability and long life time.

On customer demand we design andindustrialise Hybrid circuits lay-out, multi-layer PCBs and Flexies by using the most modern CAD and CAE programs. The hybrid production is located in a clean room and in ESD protected environment.The quality of our products, systems and processes of the production is guaranteed by our QS system ISO 9001/2000, ISO 14001:2004 and OHSAS 18001:1999.

State of the art assembling technology (SMD, Chip on Board and Die-Bonding) in combination with a variety of encapsulating methods solutions leads customer specific products.  An innovative development team and a flexible and fast production allow efficient manufacturing of each project in a short time.

AVAILABLE
TECHNOLOGIES

BENEFITS AND APPLICATIONS

RESEARCH AND DEVELOPMENT

HYBRID CIRCUITS, COB

AVAILABLE TECHNOLOGIES

• Screen printing of conductors (Ag, AgPd, AgPt, Au)

• Screen printing of metal organic pastes for thin layers (1-2 um Au, PT)

• Screen printing on ceramic substrate with thickness
from 0,15 mms to 1,2 mms

• Screen printing of multilayer systems (Ag, Au, AgPd, DE)

• CAD/CAE systems for designing hybrid circuits, PBCs, Flexies

• Functional trimming of circuits by laser systems

• Active and passive trimming of resistors (tolerance 0.1%)

• Au/Alu wedge bonding (wire diameter 18 um to 75 um)

• Die Attach (bare chip and known good die) from Wafer, Waffle Pack and Tray

• Screen printing of resistors from 50 mohms to 1 Gohm

• Mounting of SMT components, BGA, uBGA by using lead free soldering

• COB on FR4 and Flexpring

• Mounting of different electrical connections SIL, DIL and others

• Flip-Chip

• Conformal Coating

• Active and passive burn in, Thermal cycles, Life time tests

• Functional Test

AVAILABLE
TECHNOLOGIES

BENEFITS AND APPLICATIONS

RESEARCH AND DEVELOPMENT

HYBRID CIRCUITS, COB

BENEFITS

• Miniaturisation

• Functional Density

• Difficult to copy

• Thermal conductivity

• Resistant to extreme environmental conditions

• Usable in various sectors

• Simpler supplier chain

• Easy mounting

APPLICATIONS

• Automotive

• Industry and control processes

• Sensors

• Domotic and Safety

• Military and Aerospace

• Consumer goods

• Sport and leisure

• Medical

• Tools and control subsystems

• Telecommunication

• High risk areas

AVAILABLE
TECHNOLOGIES

BENEFITS AND APPLICATIONS

RESEARCH AND DEVELOPMENT

HYBRID CIRCUITS, COB

RESEARCH AND DEVELOPMENT

Development of power circuit on ceramic substrate
Development of heaters on ceramic and aluminium
Development of ceramic carriers for Si pressure sensors
Introduction to Ball Bonding .

AVAILABLE
TECHNOLOGIES

BENEFITS AND APPLICATIONS

RESEARCH AND DEVELOPMENT

Legal Information

Metallux SA (www.metallux.ch) - your innovation partner for: pressure sensor cells - pressure transducers - ceramic pressure sensors - thick film piezoresistive ceramic pressure sensors - flush membrane ceramic pressure sensor - cavity membrane ceramic pressure sensor -capacitance or capacitive ceramic pressure sensors - pressure and temperature ceramic measuring cells - pressure sensor for urea in SCR systems (selective Catalytic Reduction) - pressure range from 0,06Bar to 750 Bar- pressure sensors cell with signal conditioning output 4-20mA or 0,5-4,5V or 0/10V-pressure sensor for harsh applications - pressure transducers - pressure transmitters - absolute pressure measurement - gauge pressure measurement - sealed gauge pressure measurement - differential pressure measurement - high resistance to overpressure ceramic sensor cell - chemical resistant sensor cell to aggressive media pressure cells - packaging technology for silicon pressure sensors - thick film hybrid electronic modues manufacturing - COB - chip & wire assemblies services.

Design & Develop by treelogix media SA - CH 6934 Bioggio