Since several years we are among one of the main global manufacturer of  piezoresistive and capacity ceramic pressure sensors.

Thanks to our advanced COB  technologies, we produces also customised pressure sensors based on silicon sensitive cell.

We supply the basic components used to build up pressure trasmitters,  to be integrated in a wide range of customised pressure measurement applications and regulation systems, in  force and level measurement systems.

Thanks to our thick film technology processes we produces, on customer design, hybrid electronic circuits and modules based on a ceramic substrate. 

We offer our modern CAD/CAE design’ capabilities to develop the lay-out of  your  electronic modules based on  thick film-hybrid technology, using different substrates, like ceramic, multilayers, flexyprint etc.

We offer an advanced assembly process for microelectronic components in a clean room, for bonding of silicon dies (COB), by means of wedge bonding or ball bonding technology.

Swiss quality pressure sensors, hybrid circuits and now also the first universal line of motion control modules.