Since several years we are among one of the leading manufacturer of:

-piezoresistive ceramic pressure sensors.

-capacitive ceramic pressure sensors.

-pressure sensors with signal conditioning.

-customized pressure sensors.

-pressure sensor for harsh environment.

-customized  pressure transducers with silicon sensor or with ceramic sensor cell.

We produces the basic sensitive element component to build pressure transducers and pressure transmitters; the ceramic cell allow an easy customised integration, covering a wide range of pressure measurement applications, control  and regulation systems, level measurement, force detection and many other field.

We offer our processes to produce, on customer design:

-hybrid thick film electronic circuits.

-electronics modules on ceramic or other special substrates.

-COB (chip-on-board) assemblies based on ball-bonding process.

-COB (chip-on-board) assemblies based on wedge-bonding process.

Advanced CAD/CAE design’ capabilities are available to develop the lay-out of your electronic modules implemented on thick film-hybrid technology, using different substrates, like ceramic, multilayers, flexyprint etc. We offer a state-of-the art assembly process for microelectronic components in a clean room, for bonding (COB) of silicon dies and MEMS, by means of wedge bonding or ball bonding technology.

Swiss quality pressure sensors, hybrid circuits and now also the first universal line of motion control modules.